From mboxrd@z Thu Jan 1 00:00:00 1970 Return-path: Received: from metis.ext.pengutronix.de ([2001:67c:670:201:290:27ff:fe1d:cc33]) by bombadil.infradead.org with esmtps (Exim 4.90_1 #2 (Red Hat Linux)) id 1h0lve-000587-CG for barebox@lists.infradead.org; Mon, 04 Mar 2019 11:38:48 +0000 From: Sascha Hauer Date: Mon, 4 Mar 2019 12:38:20 +0100 Message-Id: <20190304113823.21535-4-s.hauer@pengutronix.de> In-Reply-To: <20190304113823.21535-1-s.hauer@pengutronix.de> References: <20190304113823.21535-1-s.hauer@pengutronix.de> MIME-Version: 1.0 List-Id: List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit Sender: "barebox" Errors-To: barebox-bounces+u.kleine-koenig=pengutronix.de@lists.infradead.org Subject: [PATCH 3/6] ddr_spd: Update from U-Boot To: Barebox List This updates the ddr_spd.h header file from U-Boot-2019.01 with some small changes: - typedefs are removed - "_s" suffix from struct types removed - remove unnecessary "extern" from function declarations Signed-off-by: Sascha Hauer --- arch/ppc/ddr-8xxx/ddr2_dimm_params.c | 6 +- arch/ppc/ddr-8xxx/ddr3_dimm_params.c | 10 +- arch/ppc/include/asm/fsl_ddr_sdram.h | 4 +- common/ddr_spd.c | 122 ++++- include/ddr_spd.h | 679 +++++++++++++++++++-------- 5 files changed, 604 insertions(+), 217 deletions(-) diff --git a/arch/ppc/ddr-8xxx/ddr2_dimm_params.c b/arch/ppc/ddr-8xxx/ddr2_dimm_params.c index cc7f3fa6ba..22c05ca6da 100644 --- a/arch/ppc/ddr-8xxx/ddr2_dimm_params.c +++ b/arch/ppc/ddr-8xxx/ddr2_dimm_params.c @@ -190,13 +190,13 @@ uint32_t compute_dimm_parameters(const generic_spd_eeprom_t *spdin, struct dimm_params_s *pdimm) { - const struct ddr2_spd_eeprom_s *spd = spdin; - uint32_t retval; + const struct ddr2_spd_eeprom *spd = spdin; + int retval; if (spd->mem_type != SPD_MEMTYPE_DDR2) goto error; - retval = ddr2_spd_checksum_pass(spd); + retval = ddr2_spd_check(spd); if (retval) goto error; diff --git a/arch/ppc/ddr-8xxx/ddr3_dimm_params.c b/arch/ppc/ddr-8xxx/ddr3_dimm_params.c index d510c5b265..4f44925ab9 100644 --- a/arch/ppc/ddr-8xxx/ddr3_dimm_params.c +++ b/arch/ppc/ddr-8xxx/ddr3_dimm_params.c @@ -50,7 +50,7 @@ * 010 16bits * 011 32bits */ -static uint64_t compute_ranksize(const struct ddr3_spd_eeprom_s *spd) +static uint64_t compute_ranksize(const struct ddr3_spd_eeprom *spd) { uint64_t bsize; int sdram_cap_bsize = 0, prim_bus_width = 0, sdram_width = 0; @@ -78,14 +78,14 @@ uint32_t compute_dimm_parameters(const generic_spd_eeprom_t *spdin, struct dimm_params_s *pdimm) { - const struct ddr3_spd_eeprom_s *spd = spdin; - uint32_t retval, mtb_ps; - int ftb_tmp; + const struct ddr3_spd_eeprom *spd = spdin; + uint32_t mtb_ps; + int retval, ftb_tmp; if (spd->mem_type != SPD_MEMTYPE_DDR3) goto error; - retval = ddr3_spd_checksum_pass(spd); + retval = ddr3_spd_check(spd); if (retval) goto error; diff --git a/arch/ppc/include/asm/fsl_ddr_sdram.h b/arch/ppc/include/asm/fsl_ddr_sdram.h index 2c45608e5d..f4732389f6 100644 --- a/arch/ppc/include/asm/fsl_ddr_sdram.h +++ b/arch/ppc/include/asm/fsl_ddr_sdram.h @@ -32,10 +32,10 @@ #define FSL_DDR_MIN_TCKE_PULSE_WIDTH_DDR (3) #if defined(CONFIG_FSL_DDR2) -typedef struct ddr2_spd_eeprom_s generic_spd_eeprom_t; +typedef struct ddr2_spd_eeprom generic_spd_eeprom_t; #define FSL_SDRAM_TYPE SDRAM_TYPE_DDR2 #elif defined(CONFIG_FSL_DDR3) -typedef struct ddr3_spd_eeprom_s generic_spd_eeprom_t; +typedef struct ddr3_spd_eeprom generic_spd_eeprom_t; #define FSL_SDRAM_TYPE SDRAM_TYPE_DDR3 #endif diff --git a/common/ddr_spd.c b/common/ddr_spd.c index 2110972f5b..9394c57fa3 100644 --- a/common/ddr_spd.c +++ b/common/ddr_spd.c @@ -10,39 +10,65 @@ #include #include -uint32_t ddr2_spd_checksum_pass(const struct ddr2_spd_eeprom_s *spd) +/* used for ddr1 and ddr2 spd */ +static int spd_check(const u8 *buf, u8 spd_rev, u8 spd_cksum) { - uint32_t i, cksum = 0; - const uint8_t *buf = (const uint8_t *)spd; - uint8_t rev, spd_cksum; + unsigned int cksum = 0; + unsigned int i; - rev = spd->spd_rev; - spd_cksum = spd->cksum; - - /* Rev 1.X or less supported by this code */ - if (rev >= 0x20) - goto error; + /* + * Check SPD revision supported + * Rev 1.X or less supported by this code + */ + if (spd_rev >= 0x20) { + printf("SPD revision %02X not supported by this code\n", + spd_rev); + return 1; + } + if (spd_rev > 0x13) { + printf("SPD revision %02X not verified by this code\n", + spd_rev); + } /* - * The checksum is calculated on the first 64 bytes - * of the SPD as per JEDEC specification. + * Calculate checksum */ for (i = 0; i < 63; i++) cksum += *buf++; + cksum &= 0xFF; - if (cksum != spd_cksum) - goto error; + if (cksum != spd_cksum) { + printf("SPD checksum unexpected. " + "Checksum in SPD = %02X, computed SPD = %02X\n", + spd_cksum, cksum); + return -EBADMSG; + } return 0; -error: - return 1; } -uint32_t ddr3_spd_checksum_pass(const struct ddr3_spd_eeprom_s *spd) +int ddr1_spd_check(const struct ddr1_spd_eeprom *spd) { - char crc_lsb, crc_msb; - int csum16, len; + const u8 *p = (const u8 *)spd; + + return spd_check(p, spd->spd_rev, spd->cksum); +} + +int ddr2_spd_check(const struct ddr2_spd_eeprom *spd) +{ + const u8 *p = (const u8 *)spd; + + return spd_check(p, spd->spd_rev, spd->cksum); +} + +int ddr3_spd_check(const struct ddr3_spd_eeprom *spd) +{ + char *p = (char *)spd; + int csum16; + int len; + char crc_lsb; /* byte 126 */ + char crc_msb; /* byte 127 */ /* * SPD byte0[7] - CRC coverage @@ -51,13 +77,61 @@ uint32_t ddr3_spd_checksum_pass(const struct ddr3_spd_eeprom_s *spd) */ len = !(spd->info_size_crc & 0x80) ? 126 : 117; - csum16 = crc_itu_t(0, (char *)spd, len); + csum16 = crc_itu_t(0, p, len); crc_lsb = (char) (csum16 & 0xff); crc_msb = (char) (csum16 >> 8); - if (spd->crc[0] != crc_lsb || spd->crc[1] != crc_msb) - return 1; + if (spd->crc[0] == crc_lsb && spd->crc[1] == crc_msb) { + return 0; + } else { + printf("SPD checksum unexpected.\n" + "Checksum lsb in SPD = %02X, computed SPD = %02X\n" + "Checksum msb in SPD = %02X, computed SPD = %02X\n", + spd->crc[0], crc_lsb, spd->crc[1], crc_msb); + return -EBADMSG; + } +} + +int ddr4_spd_check(const struct ddr4_spd_eeprom *spd) +{ + char *p = (char *)spd; + int csum16; + int len; + char crc_lsb; /* byte 126 */ + char crc_msb; /* byte 127 */ + + len = 126; + csum16 = crc_itu_t(0, p, len); + + crc_lsb = (char) (csum16 & 0xff); + crc_msb = (char) (csum16 >> 8); + + if (spd->crc[0] != crc_lsb || spd->crc[1] != crc_msb) { + printf("SPD checksum unexpected.\n" + "Checksum lsb in SPD = %02X, computed SPD = %02X\n" + "Checksum msb in SPD = %02X, computed SPD = %02X\n", + spd->crc[0], crc_lsb, spd->crc[1], crc_msb); + return -EBADMSG; + } + + p = (char *)((ulong)spd + 128); + len = 126; + csum16 = crc_itu_t(0, p, len); + + crc_lsb = (char) (csum16 & 0xff); + crc_msb = (char) (csum16 >> 8); + + if (spd->mod_section.uc[126] != crc_lsb || + spd->mod_section.uc[127] != crc_msb) { + printf("SPD checksum unexpected.\n" + "Checksum lsb in SPD = %02X, computed SPD = %02X\n" + "Checksum msb in SPD = %02X, computed SPD = %02X\n", + spd->mod_section.uc[126], + crc_lsb, spd->mod_section.uc[127], + crc_msb); + return -EBADMSG; + } return 0; } @@ -172,7 +246,7 @@ void ddr_spd_print(uint8_t *record) int ctime; uint8_t parity; char *ref, *sum; - struct ddr2_spd_eeprom_s *s = (struct ddr2_spd_eeprom_s *)record; + struct ddr2_spd_eeprom *s = (struct ddr2_spd_eeprom *)record; if (s->mem_type != SPD_MEMTYPE_DDR2) { printf("Can't dump information for non-DDR2 memory\n"); @@ -201,7 +275,7 @@ void ddr_spd_print(uint8_t *record) } } - if (ddr2_spd_checksum_pass(s)) + if (ddr2_spd_check(s)) sum = "ERR"; else sum = "OK"; diff --git a/include/ddr_spd.h b/include/ddr_spd.h index 01fe73c615..051275141f 100644 --- a/include/ddr_spd.h +++ b/include/ddr_spd.h @@ -1,242 +1,520 @@ +/* SPDX-License-Identifier: GPL-2.0 */ /* - * Copyright 2008 Freescale Semiconductor, Inc. - * - * This program is free software; you can redistribute it and/or - * modify it under the terms of the GNU General Public License - * Version 2 as published by the Free Software Foundation. + * Copyright 2008-2014 Freescale Semiconductor, Inc. */ #ifndef _DDR_SPD_H_ #define _DDR_SPD_H_ +/* + * Format from "JEDEC Standard No. 21-C, + * Appendix D: Rev 1.0: SPD's for DDR SDRAM + */ +struct ddr1_spd_eeprom { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char nrows; /* 5 Number of DIMM Banks */ + unsigned char dataw_lsb; /* 6 Data Width of this assembly */ + unsigned char dataw_msb; /* 7 ... Data Width continuation */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char min_delay; /* 15 for Back to Back Random Address */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char cs_lat; /* 19 CS# Latency */ + unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */ + unsigned char clk_access2; /* 24 SDRAM Access from + Clk @ CL=X-0.5 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char bank_dens; /* 31 Density of each bank on module */ + unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */ + unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */ + unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */ + unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */ + unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char res_46; /* 46 Reserved */ + unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */ + unsigned char res_48_61[14]; /* 48-61 Reserved */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + +}; + /* * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM", * SPD Revision 1.2 */ -struct ddr2_spd_eeprom_s { - uint8_t info_size; /* 0 # bytes written into serial memory */ - uint8_t chip_size; /* 1 Total # bytes of SPD memory device */ - uint8_t mem_type; /* 2 Fundamental memory type */ - uint8_t nrow_addr; /* 3 # of Row Addresses on this assembly */ - uint8_t ncol_addr; /* 4 # of Column Addrs on this assembly */ - uint8_t mod_ranks; /* 5 Number of DIMM Ranks */ - uint8_t dataw; /* 6 Module Data Width */ - uint8_t res_7; /* 7 Reserved */ - uint8_t voltage; /* 8 Voltage intf std of this assembly */ - uint8_t clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ - uint8_t clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ - uint8_t config; /* 11 DIMM Configuration type */ - uint8_t refresh; /* 12 Refresh Rate/Type */ - uint8_t primw; /* 13 Primary SDRAM Width */ - uint8_t ecw; /* 14 Error Checking SDRAM width */ - uint8_t res_15; /* 15 Reserved */ - uint8_t burstl; /* 16 Burst Lengths Supported */ - uint8_t nbanks; /* 17 # of Banks on Each SDRAM Device */ - uint8_t cas_lat; /* 18 CAS# Latencies Supported */ - uint8_t mech_char; /* 19 DIMM Mechanical Characteristics */ - uint8_t dimm_type; /* 20 DIMM type information */ - uint8_t mod_attr; /* 21 SDRAM Module Attributes */ - uint8_t dev_attr; /* 22 SDRAM Device Attributes */ - uint8_t clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ - uint8_t clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ - uint8_t clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ - uint8_t clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ - uint8_t trp; /* 27 Min Row Precharge Time (tRP)*/ - uint8_t trrd; /* 28 Min Row Active to Row Active (tRRD) */ - uint8_t trcd; /* 29 Min RAS to CAS Delay (tRCD) */ - uint8_t tras; /* 30 Minimum RAS Pulse Width (tRAS) */ - uint8_t rank_dens; /* 31 Density of each rank on module */ - uint8_t ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ - uint8_t ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ - uint8_t data_setup; /* 34 Data Input Setup Time Before Strobe - (tDS) */ - uint8_t data_hold; /* 35 Data Input Hold Time - After Strobe (tDH) */ - uint8_t twr; /* 36 Write Recovery time tWR */ - uint8_t twtr; /* 37 Int write to read delay tWTR */ - uint8_t trtp; /* 38 Int read to precharge delay tRTP */ - uint8_t mem_probe; /* 39 Mem analysis probe characteristics */ - uint8_t trctrfc_ext; /* 40 Extensions to trc and trfc */ - uint8_t trc; /* 41 Min Active to Auto refresh time tRC */ - uint8_t trfc; /* 42 Min Auto to Active period tRFC */ - uint8_t tckmax; /* 43 Max device cycle time tCKmax */ - uint8_t tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ - uint8_t tqhs; /* 45 Max Read DataHold skew (tQHS) */ - uint8_t pll_relock; /* 46 PLL Relock time */ - uint8_t Tcasemax; /* 47 Tcasemax */ - uint8_t psiTAdram; /* 48 Thermal Resistance of DRAM Package - from Top (Case) to Ambient - (Psi T-A DRAM) */ - uint8_t dt0_mode; /* 49 DRAM Case Temperature Rise from - Ambient due to Activate-Precharge/Mode - Bits (DT0/Mode Bits) */ - uint8_t dt2n_dt2q; /* 50 DRAM Case Temperature Rise from - Ambient due to Precharge/Quiet Standby - (DT2N/DT2Q) */ - uint8_t dt2p; /* 51 DRAM Case Temperature Rise from - Ambient due to Precharge Power-Down - (DT2P) */ - uint8_t dt3n; /* 52 DRAM Case Temperature Rise from - Ambient due to Active Standby (DT3N) */ - uint8_t dt3pfast; /* 53 DRAM Case Temperature Rise from - Ambient due to Active Power-Down with - Fast PDN Exit (DT3Pfast) */ - uint8_t dt3pslow; /* 54 DRAM Case Temperature Rise from - Ambient due to Active Power-Down with - Slow PDN Exit (DT3Pslow) */ - uint8_t dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from - Ambient due to Page Open Burst - Read/DT4R4W Mode Bit - (DT4R/DT4R4W Mode Bit) */ - uint8_t dt5b; /* 56 DRAM Case Temperature Rise from - Ambient due to Burst Refresh (DT5B) */ - uint8_t dt7; /* 57 DRAM Case Temperature Rise from - Ambient due to Bank Interleave Reads - with Auto-Precharge (DT7) */ - uint8_t psiTApll; /* 58 Thermal Resistance of PLL Package - form Top (Case) to Ambient - (Psi T-A PLL) */ - uint8_t psiTAreg; /* 59 Thermal Reisitance of Register - Package from Top (Case) to Ambient - (Psi T-A Register) */ - uint8_t dtpllactive; /* 60 PLL Case Temperature Rise from - Ambient due to PLL Active - (DT PLL Active) */ - uint8_t dtregact; /* 61 Register Case Temperature Rise from - Ambient due to Register Active/Mode - Bit (DT Register Active/Mode Bit) */ - uint8_t spd_rev; /* 62 SPD Data Revision Code */ - uint8_t cksum; /* 63 Checksum for bytes 0-62 */ - uint8_t mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ - uint8_t mloc; /* 72 Manufacturing Location */ - uint8_t mpart[18]; /* 73 Manufacturer's Part Number */ - uint8_t rev[2]; /* 91 Revision Code */ - uint8_t mdate[2]; /* 93 Manufacturing Date */ - uint8_t sernum[4]; /* 95 Assembly Serial Number */ - uint8_t mspec[27]; /* 99-127 Manufacturer Specific Data */ +struct ddr2_spd_eeprom { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char mod_ranks; /* 5 Number of DIMM Ranks */ + unsigned char dataw; /* 6 Module Data Width */ + unsigned char res_7; /* 7 Reserved */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char res_15; /* 15 Reserved */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */ + unsigned char dimm_type; /* 20 DIMM type information */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char rank_dens; /* 31 Density of each rank on module */ + unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ + unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ + unsigned char data_setup; /* 34 Data Input Setup Time + Before Strobe (tDS) */ + unsigned char data_hold; /* 35 Data Input Hold Time + After Strobe (tDH) */ + unsigned char twr; /* 36 Write Recovery time tWR */ + unsigned char twtr; /* 37 Int write to read delay tWTR */ + unsigned char trtp; /* 38 Int read to precharge delay tRTP */ + unsigned char mem_probe; /* 39 Mem analysis probe characteristics */ + unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char pll_relock; /* 46 PLL Relock time */ + unsigned char t_casemax; /* 47 Tcasemax */ + unsigned char psi_ta_dram; /* 48 Thermal Resistance of DRAM Package from + Top (Case) to Ambient (Psi T-A DRAM) */ + unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient + due to Activate-Precharge/Mode Bits + (DT0/Mode Bits) */ + unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient + due to Precharge/Quiet Standby + (DT2N/DT2Q) */ + unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient + due to Precharge Power-Down (DT2P) */ + unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient + due to Active Standby (DT3N) */ + unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with + Fast PDN Exit (DT3Pfast) */ + unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with Slow + PDN Exit (DT3Pslow) */ + unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient + due to Page Open Burst Read/DT4R4W + Mode Bit (DT4R/DT4R4W Mode Bit) */ + unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient + due to Burst Refresh (DT5B) */ + unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient + due to Bank Interleave Reads with + Auto-Precharge (DT7) */ + unsigned char psi_ta_pll; /* 58 Thermal Resistance of PLL Package form + Top (Case) to Ambient (Psi T-A PLL) */ + unsigned char psi_ta_reg; /* 59 Thermal Reisitance of Register Package + from Top (Case) to Ambient + (Psi T-A Register) */ + unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient + due to PLL Active (DT PLL Active) */ + unsigned char dtregact; /* 61 Register Case Temperature Rise from + Ambient due to Register Active/Mode Bit + (DT Register Active/Mode Bit) */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + }; -struct ddr3_spd_eeprom_s { +struct ddr3_spd_eeprom { /* General Section: Bytes 0-59 */ - uint8_t info_size_crc; /* 0 # bytes written into serial memory, + unsigned char info_size_crc; /* 0 # bytes written into serial memory, CRC coverage */ - uint8_t spd_rev; /* 1 Total # bytes of SPD mem device */ - uint8_t mem_type; /* 2 Key Byte / Fundamental mem type */ - uint8_t module_type; /* 3 Key Byte / Module Type */ - uint8_t density_banks; /* 4 SDRAM Density and Banks */ - uint8_t addressing; /* 5 SDRAM Addressing */ - uint8_t module_vdd; /* 6 Module nominal voltage, VDD */ - uint8_t organization; /* 7 Module Organization */ - uint8_t bus_width; /* 8 Module Memory Bus Width */ - uint8_t ftb_div; /* 9 Fine Timebase (FTB) + unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */ + unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */ + unsigned char module_type; /* 3 Key Byte / Module Type */ + unsigned char density_banks; /* 4 SDRAM Density and Banks */ + unsigned char addressing; /* 5 SDRAM Addressing */ + unsigned char module_vdd; /* 6 Module nominal voltage, VDD */ + unsigned char organization; /* 7 Module Organization */ + unsigned char bus_width; /* 8 Module Memory Bus Width */ + unsigned char ftb_div; /* 9 Fine Timebase (FTB) Dividend / Divisor */ - uint8_t mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ - uint8_t mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ - uint8_t tck_min; /* 12 SDRAM Minimum Cycle Time */ - uint8_t res_13; /* 13 Reserved */ - uint8_t caslat_lsb; /* 14 CAS Latencies Supported, + unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ + unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ + unsigned char tck_min; /* 12 SDRAM Minimum Cycle Time */ + unsigned char res_13; /* 13 Reserved */ + unsigned char caslat_lsb; /* 14 CAS Latencies Supported, Least Significant Byte */ - uint8_t caslat_msb; /* 15 CAS Latencies Supported, + unsigned char caslat_msb; /* 15 CAS Latencies Supported, Most Significant Byte */ - uint8_t taa_min; /* 16 Min CAS Latency Time */ - uint8_t twr_min; /* 17 Min Write REcovery Time */ - uint8_t trcd_min; /* 18 Min RAS# to CAS# Delay Time */ - uint8_t trrd_min; /* 19 Min Row Active to + unsigned char taa_min; /* 16 Min CAS Latency Time */ + unsigned char twr_min; /* 17 Min Write REcovery Time */ + unsigned char trcd_min; /* 18 Min RAS# to CAS# Delay Time */ + unsigned char trrd_min; /* 19 Min Row Active to Row Active Delay Time */ - uint8_t trp_min; /* 20 Min Row Precharge Delay Time */ - uint8_t tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */ - uint8_t tras_min_lsb; /* 22 Min Active to Precharge + unsigned char trp_min; /* 20 Min Row Precharge Delay Time */ + unsigned char tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */ + unsigned char tras_min_lsb; /* 22 Min Active to Precharge Delay Time */ - uint8_t trc_min_lsb; /* 23 Min Active to Active/Refresh + unsigned char trc_min_lsb; /* 23 Min Active to Active/Refresh Delay Time, LSB */ - uint8_t trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */ - uint8_t trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */ - uint8_t twtr_min; /* 26 Min Internal Write to + unsigned char trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */ + unsigned char trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */ + unsigned char twtr_min; /* 26 Min Internal Write to Read Command Delay Time */ - uint8_t trtp_min; /* 27 Min Internal Read to Precharge + unsigned char trtp_min; /* 27 Min Internal Read to Precharge Command Delay Time */ - uint8_t tfaw_msb; /* 28 Upper Nibble for tFAW */ - uint8_t tfaw_min; /* 29 Min Four Activate Window + unsigned char tfaw_msb; /* 28 Upper Nibble for tFAW */ + unsigned char tfaw_min; /* 29 Min Four Activate Window Delay Time*/ - uint8_t opt_features; /* 30 SDRAM Optional Features */ - uint8_t therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ - uint8_t therm_sensor; /* 32 Module Thermal Sensor */ - uint8_t device_type; /* 33 SDRAM device type */ - int8_t fine_tck_min; /* 34 Fine offset for tCKmin */ - int8_t fine_taa_min; /* 35 Fine offset for tAAmin */ - int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */ - int8_t fine_trp_min; /* 37 Fine offset for tRPmin */ - int8_t fine_trc_min; /* 38 Fine offset for tRCmin */ - uint8_t res_39_59[21]; /* 39-59 Reserved, General Section */ + unsigned char opt_features; /* 30 SDRAM Optional Features */ + unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ + unsigned char therm_sensor; /* 32 Module Thermal Sensor */ + unsigned char device_type; /* 33 SDRAM device type */ + int8_t fine_tck_min; /* 34 Fine offset for tCKmin */ + int8_t fine_taa_min; /* 35 Fine offset for tAAmin */ + int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */ + int8_t fine_trp_min; /* 37 Fine offset for tRPmin */ + int8_t fine_trc_min; /* 38 Fine offset for tRCmin */ + unsigned char res_39_59[21]; /* 39-59 Reserved, General Section */ /* Module-Specific Section: Bytes 60-116 */ union { struct { /* 60 (Unbuffered) Module Nominal Height */ - uint8_t mod_height; + unsigned char mod_height; /* 61 (Unbuffered) Module Maximum Thickness */ - uint8_t mod_thickness; + unsigned char mod_thickness; /* 62 (Unbuffered) Reference Raw Card Used */ - uint8_t ref_raw_card; + unsigned char ref_raw_card; /* 63 (Unbuffered) Address Mapping from Edge Connector to DRAM */ - uint8_t addr_mapping; + unsigned char addr_mapping; /* 64-116 (Unbuffered) Reserved */ - uint8_t res_64_116[53]; + unsigned char res_64_116[53]; } unbuffered; struct { /* 60 (Registered) Module Nominal Height */ - uint8_t mod_height; + unsigned char mod_height; /* 61 (Registered) Module Maximum Thickness */ - uint8_t mod_thickness; + unsigned char mod_thickness; /* 62 (Registered) Reference Raw Card Used */ - uint8_t ref_raw_card; + unsigned char ref_raw_card; /* 63 DIMM Module Attributes */ - uint8_t modu_attr; + unsigned char modu_attr; /* 64 RDIMM Thermal Heat Spreader Solution */ - uint8_t thermal; - /* 65 Register Manufacturer ID Code, LSB */ - uint8_t reg_id_lo; - /* 66 Register Manufacturer ID Code, MSB */ - uint8_t reg_id_hi; + unsigned char thermal; + /* 65 Register Manufacturer ID Code, Least Significant Byte */ + unsigned char reg_id_lo; + /* 66 Register Manufacturer ID Code, Most Significant Byte */ + unsigned char reg_id_hi; /* 67 Register Revision Number */ - uint8_t reg_rev; + unsigned char reg_rev; /* 68 Register Type */ - uint8_t reg_type; - /* 69-76 RC1,3,5..15 (MS Nib.)/RC0,2,4..14 (LS Nib.) */ - uint8_t rcw[8]; + unsigned char reg_type; + /* 69-76 RC1,3,5...15 (MS Nibble) / RC0,2,4...14 (LS Nibble) */ + unsigned char rcw[8]; } registered; - uint8_t uc[57]; /* 60-116 Module-Specific Section */ + unsigned char uc[57]; /* 60-116 Module-Specific Section */ } mod_section; /* Unique Module ID: Bytes 117-125 */ - uint8_t mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ - uint8_t mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ - uint8_t mloc; /* 119 Mfg Location */ - uint8_t mdate[2]; /* 120-121 Mfg Date */ - uint8_t sernum[4]; /* 122-125 Module Serial Number */ + unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ + unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ + unsigned char mloc; /* 119 Mfg Location */ + unsigned char mdate[2]; /* 120-121 Mfg Date */ + unsigned char sernum[4]; /* 122-125 Module Serial Number */ /* CRC: Bytes 126-127 */ - uint8_t crc[2]; /* 126-127 SPD CRC */ + unsigned char crc[2]; /* 126-127 SPD CRC */ /* Other Manufacturer Fields and User Space: Bytes 128-255 */ - uint8_t mpart[18]; /* 128-145 Mfg's Module Part Number */ - uint8_t mrev[2]; /* 146-147 Module Revision Code */ - uint8_t dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ - uint8_t dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ - uint8_t msd[26]; /* 150-175 Mfg's Specific Data */ - uint8_t cust[80]; /* 176-255 Open for Customer Use */ + unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */ + unsigned char mrev[2]; /* 146-147 Module Revision Code */ + + unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ + unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ + + unsigned char msd[26]; /* 150-175 Mfg's Specific Data */ + unsigned char cust[80]; /* 176-255 Open for Customer Use */ + }; -extern void ddr_spd_print(uint8_t *record); -extern uint32_t ddr3_spd_checksum_pass(const struct ddr3_spd_eeprom_s *spd); -extern uint32_t ddr2_spd_checksum_pass(const struct ddr2_spd_eeprom_s *spd); +/* From JEEC Standard No. 21-C release 23A */ +struct ddr4_spd_eeprom { + /* General Section: Bytes 0-127 */ + uint8_t info_size_crc; /* 0 # bytes */ + uint8_t spd_rev; /* 1 Total # bytes of SPD */ + uint8_t mem_type; /* 2 Key Byte / mem type */ + uint8_t module_type; /* 3 Key Byte / Module Type */ + uint8_t density_banks; /* 4 Density and Banks */ + uint8_t addressing; /* 5 Addressing */ + uint8_t package_type; /* 6 Package type */ + uint8_t opt_feature; /* 7 Optional features */ + uint8_t thermal_ref; /* 8 Thermal and refresh */ + uint8_t oth_opt_features; /* 9 Other optional features */ + uint8_t res_10; /* 10 Reserved */ + uint8_t module_vdd; /* 11 Module nominal voltage */ + uint8_t organization; /* 12 Module Organization */ + uint8_t bus_width; /* 13 Module Memory Bus Width */ + uint8_t therm_sensor; /* 14 Module Thermal Sensor */ + uint8_t ext_type; /* 15 Extended module type */ + uint8_t res_16; + uint8_t timebases; /* 17 MTb and FTB */ + uint8_t tck_min; /* 18 tCKAVGmin */ + uint8_t tck_max; /* 19 TCKAVGmax */ + uint8_t caslat_b1; /* 20 CAS latencies, 1st byte */ + uint8_t caslat_b2; /* 21 CAS latencies, 2nd byte */ + uint8_t caslat_b3; /* 22 CAS latencies, 3rd byte */ + uint8_t caslat_b4; /* 23 CAS latencies, 4th byte */ + uint8_t taa_min; /* 24 Min CAS Latency Time */ + uint8_t trcd_min; /* 25 Min RAS# to CAS# Delay Time */ + uint8_t trp_min; /* 26 Min Row Precharge Delay Time */ + uint8_t tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */ + uint8_t tras_min_lsb; /* 28 tRASmin, lsb */ + uint8_t trc_min_lsb; /* 29 tRCmin, lsb */ + uint8_t trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */ + uint8_t trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */ + uint8_t tfaw_msb; /* 36 Upper Nibble for tFAW */ + uint8_t tfaw_min; /* 37 tFAW, lsb */ + uint8_t trrds_min; /* 38 tRRD_Smin, MTB */ + uint8_t trrdl_min; /* 39 tRRD_Lmin, MTB */ + uint8_t tccdl_min; /* 40 tCCS_Lmin, MTB */ + uint8_t res_41[60-41]; /* 41 Rserved */ + uint8_t mapping[78-60]; /* 60~77 Connector to SDRAM bit map */ + uint8_t res_78[117-78]; /* 78~116, Reserved */ + int8_t fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */ + int8_t fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */ + int8_t fine_trrds_min; /* 119 Fine offset for tRRD_Smin */ + int8_t fine_trc_min; /* 120 Fine offset for tRCmin */ + int8_t fine_trp_min; /* 121 Fine offset for tRPmin */ + int8_t fine_trcd_min; /* 122 Fine offset for tRCDmin */ + int8_t fine_taa_min; /* 123 Fine offset for tAAmin */ + int8_t fine_tck_max; /* 124 Fine offset for tCKAVGmax */ + int8_t fine_tck_min; /* 125 Fine offset for tCKAVGmin */ + /* CRC: Bytes 126-127 */ + uint8_t crc[2]; /* 126-127 SPD CRC */ + + /* Module-Specific Section: Bytes 128-255 */ + union { + struct { + /* 128 (Unbuffered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Unbuffered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Unbuffered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 (Unbuffered) Address Mapping from + Edge Connector to DRAM */ + uint8_t addr_mapping; + /* 132~253 (Unbuffered) Reserved */ + uint8_t res_132[254-132]; + /* 254~255 CRC */ + uint8_t crc[2]; + } unbuffered; + struct { + /* 128 (Registered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Registered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Registered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + u8 reg_map; + u8 ca_stren; + u8 clk_stren; + /* 139~253 Reserved */ + u8 res_137[254 - 139]; + /* 254~255 CRC */ + uint8_t crc[2]; + } registered; + struct { + /* 128 (Loadreduced) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Loadreduced) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Loadreduced) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + uint8_t reg_map; + /* 137 Register Output Drive Strength for CMD/Add*/ + uint8_t reg_drv; + /* 138 Register Output Drive Strength for CK */ + uint8_t reg_drv_ck; + /* 139 Data Buffer Revision Number */ + uint8_t data_buf_rev; + /* 140 DRAM VrefDQ for Package Rank 0 */ + uint8_t vrefqe_r0; + /* 141 DRAM VrefDQ for Package Rank 1 */ + uint8_t vrefqe_r1; + /* 142 DRAM VrefDQ for Package Rank 2 */ + uint8_t vrefqe_r2; + /* 143 DRAM VrefDQ for Package Rank 3 */ + uint8_t vrefqe_r3; + /* 144 Data Buffer VrefDQ for DRAM Interface */ + uint8_t data_intf; + /* + * 145 Data Buffer MDQ Drive Strength and RTT + * for data rate <= 1866 + */ + uint8_t data_drv_1866; + /* + * 146 Data Buffer MDQ Drive Strength and RTT + * for 1866 < data rate <= 2400 + */ + uint8_t data_drv_2400; + /* + * 147 Data Buffer MDQ Drive Strength and RTT + * for 2400 < data rate <= 3200 + */ + uint8_t data_drv_3200; + /* 148 DRAM Drive Strength */ + uint8_t dram_drv; + /* + * 149 DRAM ODT (RTT_WR, RTT_NOM) + * for data rate <= 1866 + */ + uint8_t dram_odt_1866; + /* + * 150 DRAM ODT (RTT_WR, RTT_NOM) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_2400; + /* + * 151 DRAM ODT (RTT_WR, RTT_NOM) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_3200; + /* + * 152 DRAM ODT (RTT_PARK) + * for data rate <= 1866 + */ + uint8_t dram_odt_park_1866; + /* + * 153 DRAM ODT (RTT_PARK) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_park_2400; + /* + * 154 DRAM ODT (RTT_PARK) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_park_3200; + uint8_t res_155[254-155]; /* Reserved */ + /* 254~255 CRC */ + uint8_t crc[2]; + } loadreduced; + uint8_t uc[128]; /* 128-255 Module-Specific Section */ + } mod_section; + + uint8_t res_256[320-256]; /* 256~319 Reserved */ + + /* Module supplier's data: Byte 320~383 */ + uint8_t mmid_lsb; /* 320 Module MfgID Code LSB */ + uint8_t mmid_msb; /* 321 Module MfgID Code MSB */ + uint8_t mloc; /* 322 Mfg Location */ + uint8_t mdate[2]; /* 323~324 Mfg Date */ + uint8_t sernum[4]; /* 325~328 Module Serial Number */ + uint8_t mpart[20]; /* 329~348 Mfg's Module Part Number */ + uint8_t mrev; /* 349 Module Revision Code */ + uint8_t dmid_lsb; /* 350 DRAM MfgID Code LSB */ + uint8_t dmid_msb; /* 351 DRAM MfgID Code MSB */ + uint8_t stepping; /* 352 DRAM stepping */ + uint8_t msd[29]; /* 353~381 Mfg's Specific Data */ + uint8_t res_382[2]; /* 382~383 Reserved */ -/* * Byte 2 Fundamental Memory Types. */ + uint8_t user[512-384]; /* 384~511 End User Programmable */ +}; + +/* + * Byte 2 Fundamental Memory Types. + */ +#define SPD_MEMTYPE_FPM (0x01) +#define SPD_MEMTYPE_EDO (0x02) +#define SPD_MEMTYPE_PIPE_NIBBLE (0x03) +#define SPD_MEMTYPE_SDRAM (0x04) +#define SPD_MEMTYPE_ROM (0x05) +#define SPD_MEMTYPE_SGRAM (0x06) +#define SPD_MEMTYPE_DDR (0x07) #define SPD_MEMTYPE_DDR2 (0x08) +#define SPD_MEMTYPE_DDR2_FBDIMM (0x09) +#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) #define SPD_MEMTYPE_DDR3 (0x0B) +#define SPD_MEMTYPE_DDR4 (0x0C) /* DIMM Type for DDR2 SPD (according to v1.3) */ +#define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00) #define DDR2_SPD_DIMMTYPE_RDIMM (0x01) #define DDR2_SPD_DIMMTYPE_UDIMM (0x02) #define DDR2_SPD_DIMMTYPE_SO_DIMM (0x04) @@ -247,6 +525,41 @@ extern uint32_t ddr2_spd_checksum_pass(const struct ddr2_spd_eeprom_s *spd); #define DDR2_SPD_DIMMTYPE_MINI_UDIMM (0x20) /* Byte 3 Key Byte / Module Type for DDR3 SPD */ -#define DDR3_SPD_MODULETYPE_MASK (0x0F) +#define DDR3_SPD_MODULETYPE_MASK (0x0f) +#define DDR3_SPD_MODULETYPE_RDIMM (0x01) #define DDR3_SPD_MODULETYPE_UDIMM (0x02) +#define DDR3_SPD_MODULETYPE_SO_DIMM (0x03) +#define DDR3_SPD_MODULETYPE_MICRO_DIMM (0x04) +#define DDR3_SPD_MODULETYPE_MINI_RDIMM (0x05) +#define DDR3_SPD_MODULETYPE_MINI_UDIMM (0x06) +#define DDR3_SPD_MODULETYPE_MINI_CDIMM (0x07) +#define DDR3_SPD_MODULETYPE_72B_SO_UDIMM (0x08) +#define DDR3_SPD_MODULETYPE_72B_SO_RDIMM (0x09) +#define DDR3_SPD_MODULETYPE_72B_SO_CDIMM (0x0A) +#define DDR3_SPD_MODULETYPE_LRDIMM (0x0B) +#define DDR3_SPD_MODULETYPE_16B_SO_DIMM (0x0C) +#define DDR3_SPD_MODULETYPE_32B_SO_DIMM (0x0D) + +/* DIMM Type for DDR4 SPD */ +#define DDR4_SPD_MODULETYPE_MASK (0x0f) +#define DDR4_SPD_MODULETYPE_EXT (0x00) +#define DDR4_SPD_MODULETYPE_RDIMM (0x01) +#define DDR4_SPD_MODULETYPE_UDIMM (0x02) +#define DDR4_SPD_MODULETYPE_SO_DIMM (0x03) +#define DDR4_SPD_MODULETYPE_LRDIMM (0x04) +#define DDR4_SPD_MODULETYPE_MINI_RDIMM (0x05) +#define DDR4_SPD_MODULETYPE_MINI_UDIMM (0x06) +#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM (0x08) +#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM (0x09) +#define DDR4_SPD_MODULETYPE_16B_SO_DIMM (0x0C) +#define DDR4_SPD_MODULETYPE_32B_SO_DIMM (0x0D) + +void ddr_spd_print(uint8_t *record); +int ddr1_spd_check(const struct ddr1_spd_eeprom *spd); +void ddr1_spd_dump(const struct ddr1_spd_eeprom *spd); +int ddr2_spd_check(const struct ddr2_spd_eeprom *spd); +void ddr2_spd_dump(const struct ddr2_spd_eeprom *spd); +int ddr3_spd_check(const struct ddr3_spd_eeprom *spd); +int ddr4_spd_check(const struct ddr4_spd_eeprom *spd); + #endif /* _DDR_SPD_H_ */ -- 2.20.1 _______________________________________________ barebox mailing list barebox@lists.infradead.org http://lists.infradead.org/mailman/listinfo/barebox